How is the diamond segment technology chosen?

- May 30, 2018 -

How is the diamond segment technology chosen?


1. The choice of diamond size

When the diamond grain size is coarse and single grain size, the saw blade head is sharp and the sawing efficiency is high, but the bending strength of the diamond chip decreases. When the diamond grain size is fine or the coarse and fine grain sizes are mixed, the saw blade head has high durability, but Less efficient. Considering the above factors comprehensively, it is more appropriate to choose a diamond particle size of 50/60 mesh.

2. The choice of diamond distribution concentration

Within a certain range, when the diamond concentration changes from low to high, the sharpness and sawing efficiency of the saw blade gradually decrease, while the service life is gradually extended; but if the concentration is too high, the saw blade becomes dull. With low concentrations and coarser particles, the efficiency will increase. The use of different parts of the cutter head in sawing, using different concentrations (that is, in the three or more layers of the middle layer can be used in lower concentrations), the middle of the cutter head work to form a middle groove, there are It helps to prevent the blade from swinging, thus improving the quality of stone processing.

3. The choice of diamond strength

The strength of diamond is an important indicator of the cutting performance. Excessively high strength will make the crystal unbreakable, the abrasive particles will be polished when used, and the sharpness will decrease, which will lead to deterioration of the tool performance. When the diamond strength is not enough, it will be easily broken after being impacted and it will be difficult to bear heavy cutting tasks. Therefore, the intensity should be 130 to 140N.

4. The choice of binder phase

The performance of the saw blade depends not only on the diamond, but on the overall performance of the composite material, which is composed of the proper combination of diamond and binder. For soft materials such as marble, the mechanical properties of the cutter head are required to be relatively low, and a copper-based adhesive may be used. However, copper-based binders have low sintering temperatures, low strength, hardness, high toughness, and low bond strength with diamond. When tungsten carbide (WC) is added, WC or W2C is used as the skeleton metal, and appropriate amount of cobalt is added to improve the strength, hardness, and bonding properties, and a small amount of metals such as Cu, Sn, and Zn with low melting point and low hardness are used as bonding. phase. The particle size of the main ingredient should be finer than 200 mesh, and the particle size of the added ingredient should be finer than 300 mesh.

5. Selection of sintering process

As the temperature rises, the degree of densification of the carcass increases, and the bending strength also increases. As the holding time increases, the bending strength of the blank carcass and the diamond agglomerate increases first and then decreases, and can be selected. The 120s process is sintered at 800°C to meet the performance requirements.


Related Industry Knowledge

Related Products

  • 16 Inch Split Segment Bridge Saw Blade Granite Silent Core
  • Marble Quarry Diamond Wire Saw for Stone Quarry Machine
  • Frankfurt Silicon Carbide Antique Brushes for Marble Brushing
  • Reinforced Silicon Carbide Frankfurt Brushes for Marble
  • Silicon Carbide Granite Fickert Brushes for Antique Surface
  • Sharp Diamond Polishing Pads for Concrete Floor Polishing